Surface Gringding Wafer

The wafer thinning process mainly includes the following steps.

1. Thickness Measurement: Before and after grinding, precise thickness measurement equipment is used to monitor the wafer thickness during this process.

2. Wafer Protection: Before thinning, the wafer surface or backside needs to be protected by blue tape or UV tape which to prevent damage or contamination during the thinning process.

3. Wafer Grinding : At the beginning of the thinning process, we use the rough diamond disk to reduce the wafer thickness at firstly.