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High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications

High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications
Wholesale direct sales 2-6 inch SIN wafers Silicon wafer with SI3N4 Coating Silicon Nitride Wafer

Wholesale direct sales 2-6 inch SIN wafers Silicon wafer with SI3N4 Coating Silicon Nitride Wafer
Polished Silicon Carbide Wafer 4/6/8 Inch Z Grade P Grade D Grade Si-Type SiC Wafer

Polished Silicon Carbide Wafer 4/6/8 Inch Z Grade P Grade D Grade Si-Type SiC Wafer
Silicon wafers Reclaim Service 2-12inch Silicon wafers Oxide Nitride Wafer

Silicon wafers Reclaim Service 2-12inch Silicon wafers Oxide Nitride Wafer
High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications

High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications
High Quality 300mm 200mm 8-12inch Oxide Wafer Selection Silicon Wafe

High Quality 300mm 200mm 8-12inch Oxide Wafer Selection Silicon Wafe
High Quality 2-8inch Borofloat33 Glass Wafer Selection Silicon Wafer

High Quality 2-8inch Borofloat33 Glass Wafer Selection Silicon Wafer
Factory Supply High Quality single/double 2-12inch P Type Polished Monocrystalline Dummy Silicon wafer for semiconductor applications

Factory Supply High Quality single/double 2-12inch P Type Polished Monocrystalline Dummy Silicon wafer for semiconductor applications
Semiconductor 12 inch Silicon Wafer P Type Polished Silicon Dummy Wafer

Semiconductor 12 inch Silicon Wafer P Type Polished Silicon Dummy Wafer
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Surface Gringding Wafer

Surface Gringding wafer /Semiconductor Silicon wafersSurface Gringding wafer /Semiconductor Silicon wafers
01

Surface Gringding wafer /Semiconductor Silicon wafers
2025-01-13

The wafer thinning process mainly includes the following steps.

1. Thickness Measurement: Before and after grinding, precise thickness measurement equipment is used to monitor the wafer thickness during this process.

2. Wafer Protection: Before thinning, the wafer surface or backside needs to be protected by blue tape or UV tape which to prevent damage or contamination during the thinning process.

3. Wafer Grinding : At the beginning of the thinning process, we use the rough diamond disk to reduce the wafer thickness at firstly.

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