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Dummy silicon wafer

Testo Silicon wafer

Prime silicon wafer

Seria e produktengo

savorre

12inch 300mm DSP Dummy Grade Silicon Wafer

12inch 300mm DSP Dummy Grade Silicon ...

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silic...

6inch 150mm SSP Silicon Dummy Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

4inch SiO2 Wafer 100mm Silicon Oxide ...

FSM O Fine Silicon

Fine Silicon Manufacturing(shanghai) Ltd.

Fine Silicon Manufacturing(shanghai) Ltd.(FSM) sas kerdo ko 2008 berś thaj si les o sherutno than ko Shanghai's savo si ko Waigaoqiao Free Trade Zone. FSM si jekh kotar e maj anglune enterprize save keren buti ko procesiribe thaj bikinipe e silikon waferenqo ki Kina. Ko 2015 berś, i Japonesko filiala KOD sas kerdini ki KOD Tokyo. Akana, FSM Grupa si la duj fabrike ki Shanghai thaj Japonia, savi si la jekh ćhonesko procesosko kapaciteto 120,000pcs 12inch silicon wafers.

1000

+

Globalno kliènti
34000
M2

e produkciaqi baza

demo165-paśal

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GFINE

avantàźo

Geografikane kondicie thaj lačho transporto ki sasti lumia.

Fabrikaqi baza

2 produkciake baze ki lumia (Shanghai, Tokyo)

jxjf-advantage-2

Sigo bićhaldipen

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Personalizàcia

Amen keras personalizirime servisura

Amare kliènti (5)

Profesionalno timo

Kerdo ko 2008 berś, amaro timo si les maj but de 16 berśa eksperiènca

jxjf-advantage-5

Palal o bikinipen

Bizo griźa palal o bikinipen

SAVORRE

prodùso
Aplikàcia

1Silicon Nitride Wafer

Vaflo staklo

Le stakloske vafle si kruglo stakloske lila kerdine katar stakloske materijalura. Von si kerdine kotar diferentno vrjama staklo, kvarco, staklo bi-alkali thaj staklo-silikon kompozitno materijalo, thaj si hasnime ki semikonduktoreski thaj mikroelektronikaki industrija. Le stakloske waferura si len bari khemikani resistenca thaj termikani stabiliteta, tikni kovlipe e phuvjako, bari transmitanca, etc. Kadala karakteristike keren len butivar hasnime.

Silicium Nitride Wafer

Silicon nitride (Si3N4) wafera si ključno materiàlo anθ-e bute aplikaciě vaś o baro teknològiko vaś lenqe unikalune proporcie. Kadala waferura si maj anglal hasnime ande semikonduktoreski industria, numaj lengere aplikacie źan dur katar kodo, so kerel len jekh butivar laćho alosaripe vaś but teknologikane progresură.

3Silicon Nitride Wafer

Silicon Oxide Wafer

Le silicium oxide wafers, vi pindžarde sar silicon dioxid wafers, si integralno kotor ki semikonduktoroski industria thaj buteder tehnologikane aplikacie. Lengere unikalune proporcie keren len esencijalno vash but buti, katar e mikroelektronika dži ko optika. Kado artiklo lel jekh śukar dikhipen pe aplikacie le silikonosqe oxidosqe waferurenqe, sikavindoj lenqi importanca anθ-i moderno teknología.

Silicon Nitrud Wafer3

Silikonsko vaflo

O wafer si jekh kruglo silikonosko čipo thaj si vi o pherdo savo si kerdo te kerel integrime cirkuitura. Šaj te avel procesirime ande integrime cirkuitoske produktura save si len diferentne cirkuitoske komponente strukture thaj specifična elektrikane funkcije.

Solùcia prodùso

Geografikane kondicie thaj lačho transporto ki sasti lumia.

12INCH DUMMY WAFER

Silicon Dummy wafer

UL Tela & Kablo

Dikh maj but detalura

Silicon Test wafer

Silicon Test wafer

E automobilura andrune phanglimaske tela DIN, AS,JIS,GB

Dikh maj but detalura

Silicon Prime wafer

Silicon Prime wafer

Dikh maj but detalura

Oxido wafer

Oxido wafer

Kablo savo si kerdo ano solor Inverter

Dikh maj but detalura

maj palune nevimata

Sa e Nevimata

Termalno Oxido (SiO2) Uniformiteto e thulesko thaj dielektrikano phagipe ano Gate Oxide Testing

dàta: avgusto05,2026

Oxido termikano (SiO2) thulo...

Epitaksialno Substratura vs. Bulk CZ Wafers vash IC-ura bare Tenzijake: Performanso, Defektosko Densiteto, thaj Optimizacia e Tenzijako vash o Breakdown

dàta: avgusto04,2026

Epitaxial Substrates vs. Bu...

Jekh-rig vs. duj-rig polišime (SSP vs. DSP) Wafers Surface Roughness, Defect Metrics, and Aplication Matching

dàta: avgusto03,2026

Jekh-rig vs. duj-rig...

Ultra-Thin Silicon Wafers (

dàta: Jul31,2026

Ultra-Thin Silicon Wafers (

Bare-Temperaturake Annealed Wafers vs. Standard CZ Wafers: Eliminacia e Oksigenosqe Precipitaturenqi vaś Avansime Elektikane Aparaturǎ

dàta: Jul30,2026

Bari-Temperatura Annealed W...

O paketiribe e silikoneske vaferenqo thaj o kontrolo e kvalitetosqo so avel (IQC): Te arakhel pes o ćhivipen e rigăqo thaj e organikane kontaminaciaqo

dàta: Jul29,2026

Silicon Wafer Packaging thaj...