Products
High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications
Product Introduction:
FSM can provide dummy wafers in various sizes from 2 inches to 12 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
Wholesale direct sales 2-6 inch SIN wafers Silicon wafer with SI3N4 Coating Silicon Nitride Wafer
Product Description: SiN WAFER (Nilride)
Unlock the future of semiconductor technology with the SiN WAFER (Nilride), a pinnacle of precision and quality in the realm of silicon nitride wafers. Crafted with meticulous attention to detail, this product embodies the essence of Japanese engineering excellence, ensuring that you receive not just a wafer, but a gateway to innovation.
Polished Silicon Carbide Wafer 4/6/8 Inch Z Grade P Grade D Grade Si-Type SiC Wafer
Product Introduction:
FSM provides 100mm and 150mm SiC wafers. With its hardness (SiC is the second hardest material in the world) and stability under heat and high voltage current, this material is being widely used in several industries.
Silicon wafers Reclaim Service 2-12inch Silicon wafers Oxide Nitride Wafer
Product Introduction:
In the fast-paced world of semiconductor manufacturing, efficiency and sustainability are critical. We launch our **Silicon Wafer Recycling Service**, a cutting-edge solution designed to breathe new life into your silicon wafers while significantly reducing waste and costs.
High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications
Product Introduction:
FSM can provide dummy wafers in various sizes from 2 inches to 12 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
High Quality 300mm 200mm 8-12inch Oxide Wafer Selection Silicon Wafe
Product Introduction:
FSM can provide Oxide wafers in various sizes from 8 inches to 12 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
High Quality 2-8inch Borofloat33 Glass Wafer Selection Silicon Wafer
Product Introduction:
FSM can provide Glass wafers in various sizes from 2 inches to 8 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
Factory Supply High Quality single/double 2-12inch P Type Polished Monocrystalline Dummy Silicon wafer for semiconductor applications
Product Introduction:
FSM can provide dummy wafers in various sizes from 2 inches to 12 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
Semiconductor 12 inch Silicon Wafer P Type Polished Silicon Dummy Wafer
Product Introduction:
FSM can provide dummy wafers in various sizes from 2 inches to 12 inches, with our own factory to ensure the stable quality and controllable delivery time. We also have various testing equipment to provide parameter testing services as needed.
Polish service
The following polishing services are available:
● Wafer Diameters: 25mm (1 inch) - 300mm (12 inch)
● Single side polishing (SSP)
● Double side polishing through simultaneous or “flip” polishing techniques ( DSP)
● Backside polishing
● Kiss Polishing – Light polish which will remove minor surface scratches or defects
● Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films
● Typical Yield: >=95%
Surface Gringding wafer /Semiconductor Silicon wafers
The wafer thinning process mainly includes the following steps.
1. Thickness Measurement: Before and after grinding, precise thickness measurement equipment is used to monitor the wafer thickness during this process.
2. Wafer Protection: Before thinning, the wafer surface or backside needs to be protected by blue tape or UV tape which to prevent damage or contamination during the thinning process.
3. Wafer Grinding : At the beginning of the thinning process, we use the rough diamond disk to reduce the wafer thickness at firstly.