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Polish service

Polish servicePolish service
01

Polish service

2025-01-14

The following polishing services are available:

● Wafer Diameters: 25mm (1 inch) - 300mm (12 inch)

● Single side polishing (SSP)

● Double side polishing through simultaneous or “flip” polishing techniques ( DSP)

● Backside polishing

● Kiss Polishing – Light polish which will remove minor surface scratches or defects

● Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films

● Typical Yield: >=95%

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