0102030405
Polish service
01
view
detail
Polish service
2025-01-14
The following polishing services are available:
● Wafer Diameters: 25mm (1 inch) - 300mm (12 inch)
● Single side polishing (SSP)
● Double side polishing through simultaneous or “flip” polishing techniques ( DSP)
● Backside polishing
● Kiss Polishing – Light polish which will remove minor surface scratches or defects
● Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films
● Typical Yield: >=95%