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High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications

High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications
Wholesale direct sales 2-6 inch SIN wafers Silicon wafer with SI3N4 Coating Silicon Nitride Wafer

Wholesale direct sales 2-6 inch SIN wafers Silicon wafer with SI3N4 Coating Silicon Nitride Wafer
Polished Silicon Carbide Wafer 4/6/8 Inch Z Grade P Grade D Grade Si-Type SiC Wafer

Polished Silicon Carbide Wafer 4/6/8 Inch Z Grade P Grade D Grade Si-Type SiC Wafer
Silicon wafers Reclaim Service 2-12inch Silicon wafers Oxide Nitride Wafer

Silicon wafers Reclaim Service 2-12inch Silicon wafers Oxide Nitride Wafer
High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications

High-Quality DSP/SSP 2-12 inch Test grade Silicon Wafer for semiconductor applications
High Quality 300mm 200mm 8-12inch Oxide Wafer Selection Silicon Wafe

High Quality 300mm 200mm 8-12inch Oxide Wafer Selection Silicon Wafe
High Quality 2-8inch Borofloat33 Glass Wafer Selection Silicon Wafer

High Quality 2-8inch Borofloat33 Glass Wafer Selection Silicon Wafer
Factory Supply High Quality single/double 2-12inch P Type Polished Monocrystalline Dummy Silicon wafer for semiconductor applications

Factory Supply High Quality single/double 2-12inch P Type Polished Monocrystalline Dummy Silicon wafer for semiconductor applications
Semiconductor 12 inch Silicon Wafer P Type Polished Silicon Dummy Wafer

Semiconductor 12 inch Silicon Wafer P Type Polished Silicon Dummy Wafer
Polish service

Polish service
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Polish service

The following polishing services are available:

● Wafer Diameters: 25mm (1 inch) - 300mm (12 inch)

● Single side polishing (SSP)

● Double side polishing through simultaneous or “flip” polishing techniques ( DSP)

● Backside polishing

● Kiss Polishing – Light polish which will remove minor surface scratches or defects

● Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films

● Typical Yield: >=95%

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    product description

    Product Introduction

    Our state-of-the-art semiconductor polishing services are designed to meet the rigorous demands of the semiconductor industry. With technology advancing at an unprecedented pace, the need for precision and quality in semiconductor manufacturing has never been more critical. Our specialized polishing services ensure that your semiconductor wafers achieve the highest level of surface quality for optimal performance in a wide range of applications.

    The pursuit of excellence is at the heart of our semiconductor polishing services. We utilize advanced polishing techniques and cutting-edge equipment to deliver exceptional results. Our experienced team of professionals is dedicated to providing tailored solutions to meet the unique needs of each customer. Whether you are working with silicon, gallium arsenide, or another material, we have the expertise to enhance the surface finish of your wafers, ensuring they meet the stringent specifications required for modern electronic devices.

    Our polishing process not only improves surface smoothness, but also minimizes defects and contaminants that can severely impact the performance and reliability of semiconductor devices. We know that even the slightest defect can lead to a significant drop in efficiency and yield, which is why we employ stringent quality control measures throughout the polishing process.

    Wafer polishing is available on virgin or reclaim silicon wafer substrates. Please reference the WAFER RECLAIM section of this website for information on FSM’s wafer reclaim service solutions.

    Please CONTACT FSM for more information.

    Address
    1st Floor, 118 North Fute Road China (Shanghai) Pilot Free Trade Zone

    Email
    jeff@fsm-sh.com

    Phone
    +86-21-50681338
    +86 15026743063(Whatsapp)

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