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Prime silicon wafer a ni

Product Series a ni

zavai
12inch 300mm DSP Dummy Grade Silicon Wafer hmanga siam a ni
01 a ni

A rilru a buai em em a, a rilru a hah em em bawk a. 12inch 300mm DSP Dummy Grade Silicon ...
8inch 200mm SSP/DSP Dummy Grade Silicon Wafer hmanga siam a ni
02 a ni

A rilru a buai em em a, a rilru a hah em em bawk a. 8inch 200mm SSP/DSP Dummy Grade Silic...
6inch 150mm SSP Silicon Dummy Wafer a ni a, a man pawh a tlawm hle
03 a ni

6inch 150mm SSP Silicon Dummy Wafer a ni a, a man pawh a tlawm hle
A rilru a buai em em a, a rilru a hah em em bawk a. 4inch 100mm SSP Silicon Dummy Wafer
04 a ni

A rilru a buai em em a, a rilru a hah em em bawk a. 4inch 100mm SSP Silicon Dummy Wafer
12inch 300mm Thermal Oxide Silicon Wafer hmanga siam a ni
05 a ni

12inch 300mm Thermal Oxide Silicon Wafer hmanga siam a ni
8inch 200mm SiO2 Silicon Oxide Wafer hmanga siam a ni
06 a ni

8inch 200mm SiO2 Silicon Oxide Wafer hmanga siam a ni
6inch 150mm Thermal Oxide Silicon Wafer hmanga siam a ni
07 a ni

6inch 150mm Thermal Oxide Silicon Wafer hmanga siam a ni
4inch SiO2 Wafer 100mm Silicon Oxide Wafer hmanga siam a ni
08 a ni

4inch SiO2 Wafer 100mm Silicon Oxide hmanga siam a ni a, a man pawh a tlawm hle.

FSM a ni Fine Silicon chungchang

Fine Silicon siamchhuah(shanghai) Ltd.

Fine Silicon Manufacturing(shanghai) Ltd.(FSM )hi kum 2008 khan din a ni a, Shanghai-ah headquarter a nei a, chu chu Waigaoqiao Free Trade Zone-ah a awm a ni.FSM hi China rama silicon wafer processing leh hralhna lama thawk hmasa ber pawl a ni.Kum 2015 khan Japanese branch KOD Corporation hi Tokyo-ah din a ni.Tun dinhmunah chuan FSM Group hian plant pahnih a nei a ni Shanghai leh Japan-ah te, thla khatah 120,000pcs 12inch silicon wafers processing capacity a nei thei a ni.

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  • 1000 a ni
    +
    Khawvel pum huap customer te
  • 34000 a ni
    M2
    of production base a ni
demo165-a chungchang
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GFINE a ni

hamthatna

Geographical condition leh khawvel hmun hrang hranga kalna tur awlsam tak.
Factory atanga siam a ni
2 Bases a awm
Khawvel hmun hrang hranga production base 2 (Shanghai, Tokyo)
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Thawn
Fast Delivery a ni
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Customization hmanga siam a ni
Customized service kan pe thin
Kan Client te (5) .
Professional Team te an ni
Kum 2008-a din kan team hian kum 16 chuang zet experience kan nei tawh a ni
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Hralh zawhah
Sale zawhah lungkhamna awm lo
ZAVAI

thilsiam
Dilna

1Silicon Nitride hmanga siam a ni

Glass wafer a ni

Glass wafer hi glass sheet zungbun, glass material atanga siam a ni. Glass chi hrang hrang, quartz, alkali-free glass leh glass-silicon composite material hmanga siam an ni tlangpui a, semiconductor leh microelectronics industry-ah te an hmang thin. Glass wafer hian chemical resistance sang tak leh thermal stability a nei sang a, surface roughness a hniam a, transmittance sang tak a nei a, etc. Heng characteristics te hian hman lar tak a ni.
jxjf-case-a tam zawk
Glass wafer a ni

Silicon Nitride hmanga siam a ni

Silicon nitride (Si3N4) wafers hi a danglamna avang hian high-tech application hrang hrangah key material a ni. Heng wafer te hi semiconductor industry-ah hman a ni ber a, mahse an hman dan chuan chu aia nasa zawk a ni a, technology lama hmasawnna tam tak atan chuan duhthlanna hmanraw tangkai tak a ni.
jxjf-case-a tam zawk
3Silicon Nitride hmanga siam a ni

Silicon Oxide hmanga siam a ni

Silicon oxide wafers, silicon dioxide wafers tia hriat bawk hi semiconductor industry-a thil pawimawh tak a ni a, technology lama hmanraw hrang hrangah pawh hman theih a ni. An nihna danglam tak avangin microelectronics atanga optics thlengin hmanna hrang hrang atan an pawimawh hle. He thuziak hian silicon oxide wafer hman dan chipchiar takin a thlir a, tunlai technology lama an pawimawhzia a tarlang a ni.
jxjf-case-a tam zawk
Silicon Nitride hmanga siam chhuah a ni3

Silicon wafer a ni

Wafer hi silicon chip round tak a ni a, integrated circuit siamna atana hman thin carrier a ni bawk. Circuit component structure hrang hrang leh electrical function bik neiin integrated circuit product-ah a process theih a ni.
jxjf-case-a tam zawk

Chhanna dik thilsiam

Geographical condition leh khawvel hmun hrang hranga kalna tur awlsam tak.

12INCH DUMMY WAAFER a ni

Silicon Dummy wafer a ni

UL Wire & Cable hmanga siam a ni
A chipchiar zawkin en rawh
Silicon Test wafer a ni

Silicon Test wafer a ni

Automotive chhunga connecting wire te chu DIN, AS,JIS,GB te an ni
A chipchiar zawkin en rawh
Silicon Prime wafer a ni

Silicon Prime wafer a ni

Power Cable hmanga siam a ni
A chipchiar zawkin en rawh
Oxide wafer a ni

Oxide wafer a ni

Cable hman thin solor Inverter
A chipchiar zawkin en rawh

thu thar ber ber

Chanchin zawng zawng
Gate Oxide Test-naah Thermal Oxide (SiO2) Thickness inang leh Dielectric Breakdown a awm
01 a ni
tarikh: Aug05 a ni, .2026 khan a ni

Thermal Oxide (SiO2) a ni a, a thickn...

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High-Voltage ICs tan Epitaxial Substrates vs. Bulk CZ Wafers: A hnathawh dan, a chhiatna Density leh Breakdown Voltage Optimization te
02 a ni
tarikh: Aug04 a ni, .2026 khan a ni

Epitaxial Substrates leh Bu...

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Single-Side leh Double-Side Polished (SSP vs. DSP) Wafers chunglam roughness, Defect Metrics, leh Application matching te a awm bawk
03 a ni
tarikh: Aug03 a ni, .2026 khan a ni

Single-Side leh Double-Side inhmachhawn tur...

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A rilru a buai em em a, a rilru a hah em em bawk a. .
04 a ni
tarikh: Jul31. A rilru a hah lutuk, .2026 khan a ni

A rilru a buai em em a, a rilru a hah em em bawk a. .

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High-Temperature Annealed Wafers vs. Standard CZ Wafers: Advanced Power Devices atana Oxygen Precipitates tihbo
05 a ni
tarikh: Jul30 a ni, .2026 khan a ni

Temperature sang tak atanga Annealed W...

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Silicon Wafer Packaging leh Incoming Quality Control (IQC): Edge Chipping leh Organic Contamination venna
06 a ni
tarikh: Jul29. A rilru a hah lutuk, .2026 khan a ni

Silicon Wafer Packaging leh...

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