Hot Products

Product Introduction:

Your Gateway to Premier Semiconductor Manufacturing in China

The 12-inch Silicon Test Wafer is essential for those who aspire to excel in the top tier of semiconductor manufacturing. This high-quality product is critical for processes ranging from nano-scale pilot R&D to efficient high-volume production. The true value of these wafers lies in their adherence to rigorous technical standards and their remarkable stability. We collaborate closely with the leading silicon suppliers in Japan to provide test products that deliver unmatched performance in global flatness, nano-level surface particle control, and mechanical properties.

Our wafers are indispensable for advanced process development, daily monitoring and calibration of multi-million-dollar factory equipment, and routine maintenance to maximize production yields. By choosing us as your trusted supplier, you ensure a stable and reliable partnership for your most critical manufacturing needs in China.

The wafer thinning process is essential for enhancing semiconductor performance, and it involves several critical steps to ensure precision and quality.

Thickness Measurement: We utilize advanced thickness measurement equipment both before and after grinding to accurately monitor the wafer thickness throughout the thinning process.

Wafer Protection: Prior to thinning, it is crucial to protect the wafer surface or backside using specialized blue tape or UV tape. This step helps prevent any potential damage or contamination during the thinning operation.

Wafer Grinding: The thinning process begins with the use of a rough diamond disk, which efficiently reduces the wafer thickness to meet the required specifications.

As a leading supplier and factory in China, we are committed to delivering high-quality wafer thinning solutions that meet the industry's stringent standards.

Our 6-inch Silicon Oxide Wafer is meticulously crafted to provide outstanding film uniformity and surface flatness, catering to the high standards of advanced process development. As a top choice among China suppliers, this precisely engineered SiO₂ Wafer offers exceptional insulation and chemical stability, making it perfect for integrated circuit prototyping, dielectric studies, and nanofabrication applications. Produced in our state-of-the-art factory under rigorous quality control measures, each wafer guarantees reliable performance and consistent oxidation quality. Typically ships within 2–4 weeks.

Discover our comprehensive polishing services tailored for various wafer diameters ranging from 25mm (1 inch) to 300mm (12 inch) at our premier factory in China. Our offerings include:

● Single Side Polishing (SSP) for precise surface finishing

● Double Side Polishing (DSP) utilizing advanced simultaneous and flip polishing techniques

● Backside Polishing to achieve optimal flatness and surface quality

● Kiss Polishing, a gentle approach to eliminate minor surface scratches and imperfections

● Chemical Mechanical Planarization (CMP) designed for patterned wafer substrates and blanket films

● Consistently high yield rates of >=95%, ensuring superior quality and reliability

As a leading supplier in the industry, we are committed to delivering state-of-the-art polishing solutions to meet your needs.

Product Introduction:

Your Essential Solution for Production Line Monitoring

Introducing our 6-inch Silicon Test Wafers, the perfect blend of performance and cost-effectiveness for semiconductor fabs. These wafers are indispensable for chamber conditioning, film uniformity checks, and CMP process debugging, ensuring your production line operates smoothly and efficiently. With exceptional lot-to-lot consistency and remarkable surface flatness, our test wafers deliver accurate and reliable monitoring data to maintain stability and increase yield.

As a prominent supplier, we recognize the significance of a robust supply chain in your production processes. By utilizing our manufacturing facilities in both China and Japan, we are committed to providing a continuous and stable supply of these essential test wafers. This strategic approach allows us to effectively support your factory operations and ensure seamless production continuity.

Product Introduction:

Precision Platform for Advanced Semiconductor Manufacturing

This 8-inch Silicon Test Wafer is meticulously designed for advanced semiconductor processes, making it an essential tool for technology development, tool qualification, and monitoring critical process modules. Our wafers are tailored to achieve lower defect densities, superior crystal quality, and enhanced thermal stability, meeting the high demands set by industry leaders. As reputable suppliers with strong partnerships in China, we adhere to strict quality standards, ensuring that our products are suitable for high-end applications.

Whether utilized for advanced lithography calibration or assessing new materials such as low-k dielectrics and high-k metal gates, this test wafer serves as a reliable foundation. With our factory linked closely to the latest technological advancements, we provide a pure and stable base that supports your technology migration and process exploration.

Product Introduction:

Discover our high-quality silicon wafers manufactured in China, designed for semiconductor applications. As a leading factory and suppliers, we ensure semiconductor-grade quality with tightly controlled resistivity, minimal particle contamination, and an exceptional surface finish. Our wafers support a range of diameters from 2 to 12, making them ideal for advanced IC fabrication. Trust us to provide the premium materials you need for your technological advancements.

The 12-inch Silicon Oxide Wafer sets the benchmark for large-diameter substrate processing, ideal for advanced semiconductor and photonics manufacturing. Offered by leading Suppliers in China, this Thermal Oxide Wafer guarantees exceptional oxide uniformity, minimal defect density, and outstanding dielectric reliability within a 300mm platform. The stable Oxidized Silicon Substrate is engineered to meet the demands of next-generation devices that require precise process control and high yield performance. Discover premium quality from our Factory with a lead time of approximately 2 to 4 weeks.

Product Introduction:

Cost-Effective & Reliable Solutions for Diverse R&D Needs

Our 4-inch Silicon Test Wafers are the premier choice for academic laboratories, R&D centers, and production lines engaged in daily process monitoring and equipment maintenance. Specifically designed to be cost-effective, these wafers are perfect for training, extensive cleaning procedures, new equipment calibration, and routine deposition/etch rate tests. Manufactured in China, we guarantee high consistency in surface characteristics and electrical parameters within the same batch, providing a stable and reliable foundation for your data collection.

This product line is available with various films, including oxide, nitride, and polysilicon, to satisfy diverse process qualification requirements. Our high-specification polished wafers are sourced from established suppliers in Chinese factories renowned for their exceptional quality control, providing added assurance for your critical applications.

Product Introduction:

As a leading supplier in China, FSM offers high-quality dummy wafers ranging from 2 inches to 12 inches. With our own factory, we ensure consistent quality and reliable delivery times to meet your needs. Additionally, we provide comprehensive parameter testing services utilizing advanced testing equipment tailored to your specifications.

Product Introduction:

Our premium sapphire wafers, manufactured in China, are available in a range of diameters from 50.8mm (2) to 200mm (8), with thicknesses varying from 430μm to 1300μm depending on the size. As a leading supplier and factory of sapphire wafers, we offer products in various crystal orientations including C, R, M, and A, designed with either double-side or single-side polished surfaces. These wafers boast exceptional surface quality (Ra ≤0.3nm), minimal warp (≤10μm), and tight TTV control (≤3μm), ensuring they serve as reliable substrates for diverse optoelectronic and optical applications.