China Suppliers Factory for Surface Grinding and Thinning of Semiconductor Silicon Wafers
Wafer Thinning Process
The wafer thinning process mainly includes the following steps.
Thickness Measurement
Before and after grinding, precise thickness measurement equipment is used to monitor the wafer thickness during this process.
Wafer Protection
Before thinning, the wafer surface or backside needs to be protected by blue tape or UV tape which to prevent damage or contamination during the thinning process.
Wafer Grinding
At the beginning of the thinning process, we use the rough diamond disk to reduce the wafer thickness at firstly. After rough grinding, we used the fine diamond disk for 2nd process. This is for control the wafer thickness and improve the flatness and smoothness of the surface.
Cleaning and Inspection
After grinding, the wafer is thoroughly cleaned to remove residual, protect tape and etc. We checked each wafer to ensure that there is no obvious damage or defects on the wafer surface.
Wafer Thinning Process Flowchart
Why Choose FSM?
Expertise
With a team of seasoned professionals and cutting-edge manufacturing facilities, we consistently deliver wafers of the highest quality.
Wide Range of Products
Whether you require Czochralski (CZ) and Float Zone (FZ) silicon wafers or Oxide and glass wafers, our extensive product lineup is designed to cater to your every need.
Customization
Our specialty lies in crafting custom wafers tailored precisely to your specifications, ensuring the seamless success of your project.
Fast Turnaround
Thanks to our streamlined processes and well-stocked inventory, we guarantee swift delivery to keep your projects on track.
Global Reach
Delivering worldwide from our strategic hubs in China and Japan, we proudly serve a diverse clientele in over 50 countries.
FSM does offer wafer polishing solutions
The following polishing services are available:
- Wafer Diameters: 25mm (1 inch) - 300mm (12 inch)
- Single side polishing (SSP)
- Double side polishing through simultaneous or “flip” polishing techniques ( DSP)
- Backside polishing
- Kiss Polishing – Light polish which will remove minor surface scratches or defects
- Chemical Mechanical Planarization (CMP) of patterned wafer substrates and/or blanket films
- Typical Yield: >=95%
Wafer polishing is available on virgin or reclaim silicon wafer substrates. Please reference the WAFER RECLAIM section of this website for information on FSM’s wafer reclaim service solutions.
Please CONTACT FSM for more information.