0102030405
8inch 200mm SSP/DSP Dummy Grade Silicon Wafer
Core Highlights
· Japanese Quality Assurance: Key products are sourced from our Japanese partner facility, ensuring top-tier performance for critical tools.
· Advanced Application Support: Essential for carrier wafer applications and new tool qualification in 200mm fabs.
· Superior Surface Properties: Excellent flatness and low particle counts for use in sensitive processes.
· Dedicated Processing: Each order undergoes a dedicated QA and fulfillment cycle to meet the higher standards of advanced fabs.
Parameter Specifications
| Grow Method | Type | Dopant | Resistivity | RRV | Orientation | Slice Orientation | Diameter Tolerance | Primary Flat Location | Primary Flat Length | Thickness | TTV | Warp | Bow | Front Side | Backside |
| CZ | P | Boron | 0-100 Ω·CM | 12% | <100> | ±1° | 200±0.2mm | <110>±1° | / | 725±25um | ≦30um | ≦40um | ≦40um | Polished | Etched |



