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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

12inch 300mm DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

12inch 300mm DSP Test Grade silicon wafer

0102030405

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8-Inch Silicon Oxide Wafer - High Quality SiO2 from China Suppliers & Factory for CMOS, Photonics, and MEMS Integration

Introducing our 8-inch Silicon Oxide Wafer, meticulously crafted for production environments that demand unparalleled film quality and consistency. Our wafers are produced in our state-of-the-art factory in China, utilizing a controlled thermal oxidation process that ensures uniform oxide growth across the entire surface. Perfectly suited for CMOS, photonic, and MEMS integration, this silicon dioxide wafer supports intricate device layering and precise dielectric interfaces essential for modern applications. As reliable suppliers, we conduct thorough inspections on all wafers to guarantee their performance and reliability. Lead time for delivery is approximately 2 to 4 weeks.

Product Detail

Core Highlights

Uniform oxidation across 200mm SiO2 Wafer.
Optimized for CMOS and photonics device fabrication.
Low defect density and high insulation performance.
Stable Oxidized Silicon Substrate for multilayer processes.
Typically ships within 2–4 weeks.

Technical Specifications

Diameter

8 inch (200 mm)

Oxide Thickness

50–20000A

Oxide Type

Dry/Wet Thermal Oxide

Substrate

Prime Grade Silicon

Surface

Double Side Polished (DSP) optional

Resistivity

Specified upon order

Frequently Asked Questions

Q: What is the diameter of this SiO2 Wafer?

The wafer has a standard diameter of 8 inches (200 mm).

Q: What range of oxide thickness do you offer?

We offer oxide thicknesses ranging from 50 to 20000A, using Prime Grade Silicon as the substrate.

Q: What types of thermal oxidation are available?

We provide both Dry and Wet Thermal Oxide processes to achieve uniform oxidation across the wafer.

Q: Are these wafers suitable for CMOS fabrication?

Yes, they are optimized for both CMOS and photonics device fabrication, offering a stable oxidized silicon substrate for multilayer processes.

Q: Can I request a double-side polished surface?

Yes, a Double Side Polished (DSP) surface is optional and can be specified upon ordering.

Q: What is the typical lead time for shipping?

Orders typically ship within 2 to 4 weeks, with resistivity values specified upon order.