Products Categories

Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

12inch 300mm DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

12inch 300mm DSP Test Grade silicon wafer

0102030405

8-inch 200mm SSP/DSP Dummy Grade Silicon Wafers from China Suppliers - Quality Assured by Our Factory

Introducing our premium 8-inch Silicon Dummy Wafers, designed to meet the rigorous demands of advanced process nodes and 200mm manufacturing. As essential components for new equipment qualification and process chamber recovery, these wafers excel in thin-wafer handling applications where exceptional surface integrity and mechanical strength are critical. Our manufacturing process, primarily conducted at a state-of-the-art factory in China, ensures that we deliver top-quality wafers with renowned precision and reliability. Partnering with leading suppliers, we guarantee exceptional flatness and low particle levels, making our wafers ideal for cutting-edge 200mm fabs and sensitive epitaxy processes. Trust our Silicon Dummy Wafers for your advanced semiconductor needs and experience the difference in quality and performance

Product Detail

Core Highlights

Japanese Quality Assurance

Key products are sourced from our Japanese partner facility, ensuring top-tier performance for critical tools.

Advanced Application Support

Essential for carrier wafer applications and new tool qualification in 200mm fabs.

Superior Surface Properties

Excellent flatness and low particle counts for use in sensitive semiconductor processes.

Dedicated Processing

Each order undergoes a dedicated QA and fulfillment cycle to meet the higher standards of advanced fabs.

Parameter Specifications

Grow Method	Type	Dopant	Resistivity	RRV	Orientation	Slice Orientation	Diameter Tolerance	Primary Flat Location	Primary Flat Length	Thickness	TTV	Warp	Bow	Front Side	Backside
CZ	P	Boron	0-100 Ω·CM	12%	<100>	±1°	200±0.2mm	<110>±1°	/	725±25um	≦30um	≦40um	≦40um	Polished	Etched

Frequently Asked Questions

What are the primary applications for these 200mm wafers?

These wafers are highly optimized for carrier wafer applications and new tool qualification processes within 200mm semiconductor fabrication facilities.

Where are these wafers manufactured and quality-assured?

Our key wafer products are sourced directly from our partner facility in Japan, ensuring they adhere to strict Japanese quality assurance standards for critical semiconductor tools.

What are the key structural specifications of the CZ P-type wafer?

The wafer is grown using the Czochralski (CZ) method, doped with Boron (P-type), features a <100> orientation, and has a resistivity range of 0-100 Ω·CM.

What are the surface finishes of the front and back sides?

The wafer features a polished front side to achieve low particle counts and excellent flatness, while the backside is etched for optimal processing stability.

What are the flatness and thickness tolerances?

The nominal thickness is 725±25um, with a Total Thickness Variation (TTV) of ≦30um. Warp and bow are both strictly maintained at ≦40um to prevent deformation during sensitive processes.

How is the quality control handled for individual orders?

To meet the stringent requirements of advanced fabs, every order undergoes a dedicated quality assurance and customized fulfillment cycle before shipment.