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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP
12inch 300mm DSP Dummy Grade Silicon Wafer

12inch 300mm DSP Dummy Grade Silicon Wafer
8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer
6inch 150mm SSP Silicon Dummy Wafer

6inch 150mm SSP Silicon Dummy Wafer
4inch 100mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer
12inch 300mm Thermal Oxide Silicon Wafer

12inch 300mm Thermal Oxide Silicon Wafer
8inch 200mm SiO2 Silicon Oxide Wafer

8inch 200mm SiO2 Silicon Oxide Wafer
6inch 150mm Thermal Oxide Silicon Wafer

6inch 150mm Thermal Oxide Silicon Wafer
4inch SiO2 Wafer 100mm Silicon Oxide Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer
12inch 300mm DSP Test Grade silicon wafer

12inch 300mm DSP Test Grade silicon wafer
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8-Inch 200mm SSP/DSP Dummy Grade Silicon Wafer - Quality Manufacture from China Suppliers & Factory

Our 8-inch Silicon Dummy Wafers are essential for advanced process nodes and 200mm manufacturing, providing critical support that meets high industry standards. These wafers are vital for new equipment qualification, process chamber recovery, and functioning as carrier wafers in thin-wafer handling, where exceptional surface integrity and mechanical strength are crucial. Manufactured and quality-assured in a renowned factory in China, this product line stands out for its precision and reliability. With superior flatness and low particle levels, our wafers are perfectly suited for cutting-edge 200mm fabs and sensitive processes such as epitaxy. As trusted suppliers, we ensure that our products meet the most demanding applications, delivering quality you can depend on
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    Product Detail

    Core Highlights
    Japanese Quality Assurance

    Key products are sourced from our Japanese partner facility, ensuring top-tier performance for critical tools.

    Advanced Application Support

    Essential for carrier wafer applications and new tool qualification in 200mm fabs.

    Superior Surface Properties

    Excellent flatness and low particle counts for use in sensitive processes.

    Dedicated Processing

    Each order undergoes a dedicated QA and fulfillment cycle to meet the higher standards of advanced fabs.

    Parameter Specifications
    Grow Method Type Dopant Resistivity RRV Orientation Slice Orientation Diameter Tolerance Primary Flat Location Primary Flat Length Thickness TTV Warp Bow Front Side Backside
    CZ P Boron 0-100 Ω·CM 12% <100> ±1° 200±0.2mm <110>±1° / 725±25um ≦30um ≦40um ≦40um Polished Etched
    Frequently Asked Questions
    Where are these silicon wafers manufactured?
    Key products are sourced directly from our premier partner facility in Japan, ensuring the highest standards of Japanese Quality Assurance and reliable performance for critical fab tools.
    What are the main applications for these 200mm wafers?
    These wafers are highly optimized for advanced application support, specifically designed for carrier wafer applications and new tool qualification processes in 200mm fabrication facilities.
    What dopant and resistivity specifications do these wafers feature?
    Our wafers are P-type, doped with Boron, and feature a resistivity range of 0-100 Ω·CM, meeting standard electrical parameter requirements for sensitive semiconductor processes.
    What are the surface finishes on the front and back sides?
    These wafers feature a Polished front side to ensure excellent flatness and low particle counts, combined with an Etched backside for stable processing performance.
    How is quality control handled for high-standard fabs?
    We implement a dedicated processing flow where each order undergoes an individual, strict quality assurance (QA) and fulfillment cycle to meet the rigorous standards demanded by advanced fabs.

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