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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

12inch 300mm DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

12inch 300mm DSP Test Grade silicon wafer

0102030405

8-inch 200mm Dummy Grade Silicon Wafer - High Precision from China Suppliers and Factory for Advanced Processes

Introducing our 8-inch Silicon Dummy Wafers, essential for supporting advanced process nodes and 200mm manufacturing. These wafers are crucial for new equipment qualification, process chamber recovery, and act as carrier wafers in thin-wafer handling, where exceptional surface integrity and mechanical strength are vital. As one of the leading suppliers in China, we ensure a large portion of this product line is expertly manufactured and quality-assured at our state-of-the-art factory in collaboration with our Japanese partner. With unparalleled flatness and low particle levels, our wafers are perfectly suited for cutting-edge 200mm fabs and delicate processes such as epitaxy, ensuring precision and reliability you can trust

Product Detail

Core Highlights

Japanese Quality Assurance

Key products are sourced from our Japanese partner facility, ensuring top-tier performance for critical tools.

Advanced Application Support

Essential for carrier wafer applications and new tool qualification in 200mm fabs.

Superior Surface Properties

Excellent flatness and low particle counts for use in sensitive semiconductor processes.

Dedicated Processing

Each order undergoes a dedicated QA and fulfillment cycle to meet the higher standards of advanced fabs.

Parameter Specifications

Grow Method	Type	Dopant	Resistivity	RRV	Orientation	Slice Orientation	Diameter Tolerance	Primary Flat Location	Primary Flat Length	Thickness	TTV	Warp	Bow	Front Side	Backside
CZ	P	Boron	0-100 Ω·CM	12%	<100>	±1°	200±0.2mm	<110>±1°	/	725±25um	≦30um	≦40um	≦40um	Polished	Etched

Frequently Asked Questions (FAQ)

1. Where are these silicon wafers manufactured?

Our key silicon wafer products are sourced directly from our partner facility in Japan, ensuring top-tier quality assurance and reliable performance for critical semiconductor tools.

2. What are the primary applications for these 200mm wafers?

These wafers are specifically designed and essential for carrier wafer applications as well as new tool qualifications within 200mm fabrication facilities (fabs).

3. What are the surface finish specifications for the front and back sides?

The wafers feature a polished front side and an etched backside, providing superior surface properties with excellent flatness and low particle counts suitable for sensitive processes.

4. What are the resistivity and thickness tolerances of these wafers?

These P-type (Boron-doped) CZ wafers feature a resistivity range of 0-100 Ω·CM, a thickness of 725±25µm, and a Total Thickness Variation (TTV) of ≦30µm.

5. How is quality control managed for wafer orders?

Each order undergoes a dedicated quality assurance (QA) and fulfillment cycle. This tailored process ensures the final products comply with the strict, high-level standards required by advanced fabs.