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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP
12inch 300mm DSP Dummy Grade Silicon Wafer

12inch 300mm DSP Dummy Grade Silicon Wafer
8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer
6inch 150mm SSP Silicon Dummy Wafer

6inch 150mm SSP Silicon Dummy Wafer
4inch 100mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer
12inch 300mm Thermal Oxide Silicon Wafer

12inch 300mm Thermal Oxide Silicon Wafer
8inch 200mm SiO2 Silicon Oxide Wafer

8inch 200mm SiO2 Silicon Oxide Wafer
6inch 150mm Thermal Oxide Silicon Wafer

6inch 150mm Thermal Oxide Silicon Wafer
4inch SiO2 Wafer 100mm Silicon Oxide Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer
12inch 300mm DSP Test Grade silicon wafer

12inch 300mm DSP Test Grade silicon wafer
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6-Inch Silicon Dummy Wafers from China Suppliers | Durable Factory-Engineered Solutions for CMP and Equipment Monitoring

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Engineered for durability and consistency, our 6-inch Silicon Dummy Wafers are essential consumables for high-volume manufacturing environments. These products are extensively used in CMP dummy runs, furnace tube fills, and continuous equipment monitoring within mainstream production fabs. Their robust design ensures reliable performance in demanding applications, stabilizing equipment, preventing process drift, and protecting your overall yield.

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Our flexible, dual-source supply chain benefits customers with reliable access to a significant volume of these wafers produced in our high-capacity factory in China. For enhanced performance, premium grades are sourced from our top-tier suppliers in Japan, ensuring steady availability and superior quality.

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    Product Detail

    Core Highlights
    Production-Proven Reliability

    Built for endurance in high-volume CMP (Chemical Mechanical Planarization) and diffusion furnace processes.

    Stable Supply Chain

    Dual-source manufacturing from our China and Japan sites ensures a consistent, secure, and reliable global supply.

    Optimized for Manufacturing

    Delivered within a highly predictable lead time to keep your production schedule and fab operations on track.

    Yield Protection

    Plays a vital role in equipment monitoring and process stabilization, directly contributing to final yield preservation.

    Parameter Specifications
    Grow Method Type Dopant Resistivity RRV Orientation Slice Orientation Diameter Tolerance Primary Flat Location Primary Flat Length Thickness TTV Warp Bow Front Side Backside
    CZ P/N Boron 0-100 Ω·CM 12% <100> ±1° 150±0.3mm <110>±1° 57.5±2.5mm 675±25um ≦30um ≦30um ≦30um Polished Etched
    Frequently Asked Questions

    1. What are the main applications for these CZ Silicon Wafers?

    These wafers are specifically optimized for equipment monitoring, process stabilization, and endurance during high-volume Chemical Mechanical Planarization (CMP) and diffusion furnace processes.

    2. How does the dual-source manufacturing model benefit my supply chain?

    By producing wafers in both our China and Japan facilities, we mitigate geopolitical and logistical risks, ensuring a highly stable, redundant, and consistent supply flow to your fabs.

    3. What are the surface finish specifications for the front and back sides?

    The front side is polished to a high-quality mirror finish suitable for precise lithography and monitoring, while the backside is etched to optimize mechanical handling and thermal contact.

    4. Can these wafers withstand high-temperature furnace steps?

    Yes, being grown via the Czochralski (CZ) method with controlled oxygen and carbon content, they offer the mechanical integrity and thermal stability required for demanding diffusion furnace cycles.

    5. What is the typical lead time for standard parameter orders?

    Thanks to our optimized manufacturing pipelines in dual locations, we offer highly predictable and competitive lead times. Specific timelines can be confirmed upon request depending on order volume.

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