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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP
12inch 300mm DSP Dummy Grade Silicon Wafer

12inch 300mm DSP Dummy Grade Silicon Wafer
8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer
6inch 150mm SSP Silicon Dummy Wafer

6inch 150mm SSP Silicon Dummy Wafer
4inch 100mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer
12inch 300mm Thermal Oxide Silicon Wafer

12inch 300mm Thermal Oxide Silicon Wafer
8inch 200mm SiO2 Silicon Oxide Wafer

8inch 200mm SiO2 Silicon Oxide Wafer
6inch 150mm Thermal Oxide Silicon Wafer

6inch 150mm Thermal Oxide Silicon Wafer
4inch SiO2 Wafer 100mm Silicon Oxide Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer
12inch 300mm DSP Test Grade silicon wafer

12inch 300mm DSP Test Grade silicon wafer
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6-inch Silicon Dummy Wafer from Reliable China Suppliers | High-Quality Factory Production for CMP and Equipment Monitoring

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Designed for exceptional durability and consistency, our 6-inch Silicon Dummy Wafers are essential consumables for high-volume manufacturing environments. Extensively utilized for CMP dummy runs, furnace tube fills, and continuous equipment monitoring in mainstream production fabs, these wafers feature a robust design that ensures reliable performance in demanding applications. They play a crucial role in stabilizing equipment, preventing process drift, and safeguarding overall yield.

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Thanks to our flexible, dual-source supply chain, a substantial volume of our products is manufactured in our high-capacity factory in China, ensuring steady availability. Additionally, premium grades are linked to our Japanese facility for enhanced performance. This strategic approach positions us as a leading supplier in the market, delivering high-quality solutions tailored to the needs of our customers.

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    Product Detail

    Core Highlights

    Production-Proven Reliability

    Built for endurance in high-volume CMP and diffusion furnace processes.

    Stable Supply Chain

    Dual-source manufacturing from our China and Japan sites ensures a consistent and reliable supply.

    Optimized for Manufacturing

    Delivered within a predictable lead time to keep your production schedule on track.

    Yield Protection

    Plays a vital role in equipment monitoring and process stabilization, directly contributing to yield preservation.

    Parameter Specifications

    Grow Method Type Dopant Resistivity RRV Orientation Slice Orientation Diameter Tolerance Primary Flat Location Primary Flat Length Thickness TTV Warp Bow Front Side Backside
    CZ P/N Boron 0-100 Ω·CM 12% <100> ±1° 150±0.3mm <110>±1° 57.5±2.5mm 675±25um ≦30um ≦30um ≦30um Polished Etched

    Frequently Asked Questions

    What applications are these wafers optimized for?
    These wafers are built for endurance and high reliability in high-volume CMP (Chemical Mechanical Planarization) and diffusion furnace processes.
    How is the supply stability guaranteed?
    We maintain a dual-source manufacturing supply chain with production sites in both China and Japan to ensure a consistent and uninterrupted supply.
    What dopant and resistivity specifications do these wafers have?
    The wafers utilize Boron as the dopant (P/N Type) with a resistivity range of 0-100 Ω·CM.
    What are the physical dimension tolerances?
    The wafers have a diameter tolerance of 150±0.3mm, thickness of 675±25um, and TTV, Warp, and Bow values all within ≦30um.
    How do these wafers contribute to yield protection?
    They play a vital role in equipment monitoring and process stabilization, which directly helps in preserving manufacturing yield.
    What are the surface finishes of the front and back sides?
    The front side of the wafer is polished, while the backside is etched.

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