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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

12inch 300mm DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

12inch 300mm DSP Test Grade silicon wafer

0102030405

4-Inch 100mm Silicon Dummy Wafer from Trusted China Suppliers | High-Quality Factory Manufacturing

Introducing our 4-inch Silicon Dummy Wafers , essential consumables that play a crucial role in the daily operations of semiconductor factories. Designed for vital tasks including chamber fill, tool seasoning, and protective runs during maintenance and startup, these wafers act as a dependable barrier against contamination. Protecting your valuable product wafers ensures tool stability and longevity, making them a must-have for R&D labs, pilot lines, and processes utilizing mature nodes.

Our wafers are sourced from a reliable network of trusted suppliers in China, with premium selections available from our Japanese partners, ensuring consistent performance and outstanding value for your factory needs.

Product Detail

Core Highlights

Essential Tool Protection

Ideal for chamber conditioning and safeguarding equipment during maintenance cycles.

Cost-Effective Solution

Maximizes your consumables budget for high-frequency, non-product applications.

Rapid Deployment

As a standard stocked size, orders are processed and prepared for shipment within our standard lead time.

Flexible Sourcing

Primarily supplied from our cost-optimized Asian supply chain, with select Japanese-sourced options for critical needs.

Parameter Specifications

Grow Method	Type	Dopant	Resistivity	RRV	Orientation	Slice Orientation	Diameter Tolerance	Primary Flat Location	Primary Flat Length	Thickness	TTV	Warp	Bow	Front Side	Backside
CZ	P/N	Boron	0-100 Ω·CM	12%	<100>	±1°	100±0.3mm	<110>±1°	32.5±2.5mm	525±25um	≦30um	≦30um	≦30um	Polished	Etched

Frequently Asked Questions

What are the primary applications for these wafers?

These wafers are ideal for chamber conditioning and safeguarding expensive equipment during routine maintenance cycles.

How do these wafers help optimize manufacturing costs?

They serve as a cost-effective solution designed to maximize your consumables budget, especially for high-frequency, non-product applications.

What is the estimated delivery time for an order?

Since these wafers come in a standard stocked size, your order will be processed and prepared for shipment within our standard lead time for rapid deployment.

Where are these wafers manufactured and sourced?

We offer flexible sourcing: they are primarily supplied from our cost-optimized Asian supply chain, but we also offer select Japanese-sourced options for critical requirements.

What are the key technical specifications of the wafer?

The wafers are grown using the CZ method, doped with Boron (P/N type), feature a <100> orientation, and have a thickness of 525±25um with a polished front side and etched backside.