0102030405
12inch 300mm DSP Dummy Grade Silicon Wafer
Core Highlights
· Premium Japanese Sourcing: Primarily manufactured in our Japanese facility, guaranteeing elite material quality and consistency.
· For Leading-Edge Technology: Essential for supporting EUV lithography and the development of next-generation semiconductor devices.
· Mission-Critical Performance: Engineered for the most demanding tasks in 300mm fabs, including plasma cleaning and use as benchmark wafers.
· Elite Fulfillment Program: All orders are managed under a premium fulfillment program to ensure integrity and timely delivery for critical fab operations.
Parameter Specifications
| Grow Method | Type | Dopant | Resistivity | RRV | Orientation | Slice Orientation | Diameter Tolerance | Primary Flat Location | Primary Flat Length | Thickness | TTV | Warp | Bow | Front Side | Backside |
| CZ | P | Boron | 0-100 Ω·CM | 12% | <100> | ±1° | 300±0.2mm | <110>±1° | / | 775±25um | ≦30um | ≦40um | ≦40um | Polished | Polished |



