12-inch 300mm DSP Test Grade Silicon Wafer from China Suppliers | factory for Semiconductor Manufacturing
Core Highlights
Parameter Specifications
| Grow Method | Type | Dopant | Resistivity | RRV | Orientation | Slice Orientation | Diameter Tolerance | Primary Flat Location | Primary Flat Length | Thickness | TTV | Warp | Bow | Particle | Surface Metals | Front Side | Backside |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CZ | P | Boron | 1-100 Ω·CM | 12% | <100> | ±1° | 300±0.2mm | <110>±1° | / | 775±25um | ≦10um | ≦40um | ≦40um | 0.3um@≦40ea 0.2um@≦50ea |
≦1E10 | Polished | Polished |
* For any additional film types, film thickness, or composition inquiries, please feel free to contact us. Our expert team is here to assist you with tailored solutions.
Introducing Our Premium Silicon Wafers: Precision Engineered for Future Technologies
As a leader in semiconductor innovation, we have been committed to excellence since our founding in 2008. With our Asia Pacific headquarters in Tokyo, Japan, and major production sites in Tokyo and Shanghai, China, we are uniquely positioned to serve our global customers with unparalleled efficiency and quality. Our commitment to high standards and stringent requirements ensures that we deliver only the best products to meet the ever-changing demands of the technology sector.
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