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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

12inch 300mm DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

12inch 300mm DSP Test Grade silicon wafer

0102030405

12-Inch 300mm DSP Dummy Grade Silicon Wafer - High Purity from China Suppliers and Factory for Advanced Manufacturing

Introducing our premium 12-inch Silicon Dummy Wafers, expertly designed for the most advanced 300mm manufacturing facilities around the globe. Sourced primarily from our leading factory in Japan, these wafers are indispensable for cutting-edge process development, safeguarding multi-million-dollar EUV lithography tools, and ensuring stability in high-volume production environments. Our products meet stringent specifications for nanoscale surface topology and minimal metallic contamination, making them the preferred choice for critical applications such as plasma chamber cleaning and film deposition calibration. As a trusted supplier based in China, we prioritize delivering exceptional quality and performance, making our Silicon Dummy Wafers essential for any top-tier semiconductor manufacturing process

Product Detail

Core Highlights

Premium Japanese Sourcing

Primarily manufactured in our Japanese facility, guaranteeing elite material quality and consistency.

Leading-Edge Technology

Essential for supporting EUV lithography and the development of next-generation semiconductor devices.

Mission-Critical Performance

Engineered for the most demanding tasks in 300mm fabs, including plasma cleaning and use as benchmark wafers.

Elite Fulfillment Program

All orders are managed under a premium fulfillment program to ensure integrity and timely delivery for critical fab operations.

Parameter Specifications

Grow Method	Type	Dopant	Resistivity	RRV	Orientation	Slice Orientation	Diameter Tolerance	Primary Flat Location	Primary Flat Length	Thickness	TTV	Warp	Bow	Front Side	Backside
CZ	P	Boron	0-100 Ω·CM	12%	<100>	±1°	300±0.2mm	<110>±1°	/	775±25um	≦30um	≦40um	≦40um	Polished	Polished

Frequently Asked Questions

Q Where are these semiconductor wafers manufactured?

They are primarily manufactured in our specialized Japanese facility, which guarantees elite material quality, consistency, and strict manufacturing standards.

Q What key technologies do these wafers support?

These wafers are essential for supporting advanced EUV (Extreme Ultraviolet) lithography processes and the development of next-generation semiconductor devices.

Q What are the primary applications for these 300mm wafers?

They are engineered for demanding tasks in 300mm fabrication facilities, including critical applications like plasma cleaning and serving as high-standard benchmark wafers.

Q What are the dopant type and resistivity specifications?

The wafers are P-type, doped with Boron, and feature a resistivity specification of 0-100 Ω·CM.

Q What surface finish is applied to the front and back sides of the wafers?

Both the front side and the backside of the wafers are fully polished to meet high-precision semiconductor processing requirements.

Q How is the delivery and integrity of these wafers ensured?

All orders are managed under our elite fulfillment program, specifically designed to ensure material integrity and timely delivery for critical fab operations.