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Sapphire Wafers — 50.8mm to 200mm, C/R/M/A Orientation, DSP/SSP

12inch 300mm DSP Dummy Grade Silicon Wafer

8inch 200mm SSP/DSP Dummy Grade Silicon Wafer

6inch 150mm SSP Silicon Dummy Wafer

4inch 100mm SSP Silicon Dummy Wafer

12inch 300mm Thermal Oxide Silicon Wafer

8inch 200mm SiO2 Silicon Oxide Wafer

6inch 150mm Thermal Oxide Silicon Wafer

4inch SiO2 Wafer 100mm Silicon Oxide Wafer

12inch 300mm DSP Test Grade silicon wafer

0102030405

12-Inch 300mm DSP Dummy Grade Silicon Wafer from China Suppliers - High Purity for Advanced Manufacturing Factory

Introducing our premium 12-inch Silicon Dummy Wafers, meticulously crafted for the most advanced 300mm manufacturing facilities globally. Proudly sourced from our leading factory in Japan, these wafers are essential for cutting-edge process development and safeguarding multi-million-dollar EUV lithography equipment. As a trusted supplier in the industry, we ensure that our wafers meet stringent specifications for nanoscale surface topology and minimal metallic contamination. They are the preferred choice for critical applications such as plasma chamber cleaning and film deposition calibration. Choose our Silicon Dummy Wafers for unparalleled purity and performance, and experience the difference in high-volume production stability

Product Detail

Core Highlights

Premium Japanese Sourcing

Primarily manufactured in our Japanese facility, guaranteeing elite material quality and consistency.

For Leading-Edge Technology

Essential for supporting EUV lithography and the development of next-generation semiconductor devices.

Mission-Critical Performance

Engineered for the most demanding tasks in 300mm fabs, including plasma cleaning and use as benchmark wafers.

Elite Fulfillment Program

All orders are managed under a premium fulfillment program to ensure integrity and timely delivery for critical fab operations.

Parameter Specifications

Grow Method	Type	Dopant	Resistivity	RRV	Orientation	Slice Orientation	Diameter Tolerance	Primary Flat Location	Primary Flat Length	Thickness	TTV	Warp	Bow	Front Side	Backside
CZ	P	Boron	0-100 Ω·CM	12%	<100>	±1°	300±0.2mm	<110>±1°	/	775±25um	≦30um	≦40um	≦40um	Polished	Polished

Frequently Asked Questions

Where are these 300mm wafers manufactured?

These semiconductor wafers are primarily manufactured in our advanced facility in Japan, which guarantees elite material quality, strict process controls, and consistent product performance.

What are the primary applications for these CZ P Boron wafers?

They are specifically engineered for next-generation semiconductor device development, EUV lithography support, and mission-critical tasks in 300mm fabs, including plasma cleaning processes and use as benchmark wafers.

What are the key thickness and flatness specifications?

The wafers feature a nominal thickness of 775±25um. Flatness tolerances are strictly controlled with Total Thickness Variation (TTV) of ≦30um, Warp of ≦40um, and Bow of ≦40um.

What are the surface finishes of the front and back sides?

Both the front side and the backside of the wafers are polished (Double-Side Polished) to meet the stringent cleanliness and flatness requirements of modern fab environments.

How are delivery and transport integrity guaranteed?

All orders are managed under our Elite Fulfillment Program. This premium service ensures secure packaging, strict handling protocols, and timely delivery to support continuous and critical fab operations.